From System-on-Chip (soc) to System on Multi-Chip (somc) Architectures: Scaling Integrated Systems Beyond the Limitations of Deep-Submicron Single Chip Technologies.

Christopher Patrick,S. C. Song,Irfan Khan,Nader Nikfar, Matt Severson, Shree Pandey, Matt Kaiser, Manav Shah, Pat Lawlor, Deb Marich, Carina Affinito, Rajeev Jain

2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)(2022)

引用 0|浏览13
暂无评分
关键词
die-to-die interface design,thermal network,impractical die sizes,IP integration platforms,system on multichip architectures,automotive AI servers,deep-submicron single chip technologies,integrated systems,SoMC,multichip architectures,system-on-chip,chip design flow,power distribution network,architecture design,multichip configuration,multiple die,future deep sub-micron technology nodes,diverse markets,technology shrinks,SoC,complex systems,mobile wireless revolution
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要