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First Demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP.

Giulio Marti,Ankit Pokhrel,Gayle Murdoch,Gilles Delie,Anshul Gupta, Philippe Marien,Alicja Lesniewska,Stefan Decoster,Souvik Kundu,Quoc Toan Le,Yusuke Oniki,Bart Kenens, Yanick Hermans,Seongho Park,Zsolt Tokei

2024 IEEE International Interconnect Technology Conference (IITC)（2024）

引用 4|浏览25
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关键词
Ruthenium,fully self-aligned vias,Semi-damascene,Interconnect,Subtractive etch,BEOL
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