Micromechanical Adhesion Experiments and Simulation on Cu-Damascene Processed Test Devices
IEEE transactions on device and materials reliability（2023）
关键词
Testing,Delamination,Copper,Force,Strain,Plastics,Load modeling,FEM-simulations,interconnect reliability,interface testing,in-situ micromechanical testing
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要