Adhesion property between low-thermal- expansion poly (benzoxazole-imide) film and ion-implanted copper

Chao Cui,Lili Yuan,Liang Yin,Yudong Huang,Linghui Meng,Nianqun Yang,Shiyong Yang

CAILIAO GONGCHENG-JOURNAL OF MATERIALS ENGINEERING（2022）

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benzoxazole,polyimide,ion implantation,flexible cupper clad laminate,peel strength
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