A Novel Non-destructive Failure Location method for electronic components based on TDR technology

With the development of miniaturized and integrated electronic devices, failure location plays an increasingly important role in the analysis of the failure devices. As a novel non-destructive failure location method, the Time domain reflection (TDR) technology is widely cited in the fields of cable transmission, soil performance testing, and liquid level detection due to its good compatibility, simple operation, and high accuracy. In recent years, TDR technology gradually began to be applied in the electronics industry. However， the failure location technology based on TDR in the electronics industry is still relatively weak. In this paper, the principle of TDR technology, TDR failure location method and failure cases are elaborated in turn, which verifies the feasibility of failure location technology based on TDR applied in electronic industry such as printed circuit board (PCB) and printed circuit board assembly (PCBA), and provides methodological guidance for the failure location of TDR technology in electronic industry.