Inlet/outlet Induced Failures During Flip-Chip Bonding of Large Area Chip with Embedded Microchannels

Since the embedded microchannel heat sink has become a potential thermal management technology developed for the next generation of power devices to ensure the reliability of the embedded microchannel chip. The finite element simulation technology was used to investigate the influence of different shapes of liquid inlets and outlets of the embedded microchannel chip during the flip-chip bonding process and carried out experiments to prove the simulation prediction. The results show that the optimized design of the shapes of liquid inlets and outlets can effectively reduce the stress performance of the chip. The maximal thermal stress of chips will decrease by more than 70 %. To the best of our knowledge, there is currently no research report in this area in the world. This work is of great significance in promoting the practical application of microfluidic chips.