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Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package

Chinami Marushima,Toyohiro Aoki,Koki Nakamura,Risa Miyazawa,Akihiro Horibe,Isabel de Sousa,Kamal Sikka,Takashi Hisada

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)（2022）

引用 2|浏览22
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关键词
Direct Bonded heterogeneous Integration,Si bridge,Capillary underfill
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