Validation of a new methodological approach for the selection of wire-coil inserts in thermal equipment
Applied Thermal Engineering（2023）
Key words
Methodology for wire-coil selection,Heat transfer enhancement,Wire-coil inserts,Transition Shape Parameter (TSP),Friction factor,Enhanced flat-plate solar collector
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined