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Elemental Diffusion Behavior of Cu–Ti Alloys Prepared by Accumulative Roll Bonding‐Deformation Diffusion Process

Materials science and engineering A, Structural materials proporties, microstructures and processing/Materials science & engineering A, Structural materials properties, microstructure and processing(2022)

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关键词
accumulative roll bonding-deformation diffusion,Cu-Ti alloys,diffusion model,thermomechanical coupling
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