谷歌浏览器插件
订阅小程序
在清言上使用

On the Correlation Between Near-Field Scan Immunity and Radiated Immunity at Printed Circuit Board Level – Part II

IEEE transactions on electromagnetic compatibility(2022)

引用 0|浏览0
暂无评分
摘要
The work presented in this two-part paper focuses on a prediction method of the radiated susceptibility of integrated circuit and printed circuit board from near-field scan injection, in order to anticipate risks of noncompliance due to design weakness. In Part I, a worst-case estimator of the far-field induced voltage on a PCB trace was proposed. Based on it, an estimator of the radiated susceptibility of a printed circuit board based on near-field scan results is derived and validated through two validation case studies.
更多
查看译文
关键词
Noise measurement,Voltage,Probes,Couplings,Microstrip,Upper bound,Load modeling,Calibration,ear-field scan,near-field (NF) probe,radiated immunity (RI)
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要