Conformal Resist Coating Technique for TSV Manufacturing Process by Electrostatic Spray

S. Kurokawa, T. Hotokebuchi, Y. Uchiyama, K. Miyachi, Y. Kobayashi,T. Hayashi,K. Matsuo

PROCEEDINGS OF THE 38TH INTERNATIONAL MATADOR CONFERENCE（2022）

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关键词

Spray coating, Photo-resist, Through-silicon via, MEMS, Electrostatic spray

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