Carbon doped lead-free perovskite with superior mechanical and thermal stability

This theoretical study looks into the mechanical and thermal behaviour of CH(3)NH(3)SnIxBr(3-x):PCBM. Large-scale Atomic/Molecular Massively Parallel Simulator (LAMMPS) and Packmol software and Molecular Dynamic Methods are applied for simulation and computation. The stress-strain profile, Young's modulus, and the density of the lattice are studied by inserting a load in different directions. Poisson's ratio for the PCBM doped CH(3)NH(3)SnIxBr(3-x) was calculated via coding by Packmol software. In detail, a certain load was clamped onto the CH(3)NH(3)SnIxBr(3-x): PCBM lattice. Then the elongation was indicated in different directions (X, Y, Z), and the stress-strain curve and Young's modulus were obtained. Lastly, the mechanical behaviour of CH(3)NH(3)SnIxBr(3-x): PCBM were studied basing on three different lattice orientations, and the assumption of bearing a specific tension at three different temperatures taken. The calculated Young's modulus and Poisson's ratio were very close to the experimental data previously reported, and this proved the high accuracy of this simulation work. This theoretical study therefore, profoundly addresses the current demands on extending the lifetime of perovskite and perovskite issuing devices.