Determination of Rate- and Temperature Dependent Inelastic Material Data for Sintered Silver Die Attach and Simulative Implementation

The higher operating temperatures of power modules based on wide-bandgap semiconductors demand a better understanding and modeling of the viscoplastic material behavior of the die attach layer, in this case sintered silver (SAG). Within a physics-of-failure approach, the damage caused by viscoplastic and plastic deformation is crucial for the estimation of lifetime and reliability of the power mod...