BGA Routing Impact on High-Speed Signals
2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)(2021)
摘要
To meet the growing demand for data consumption, IO speeds, IO ports, CPU core count and pin density continue to increase every generation. In the last few generations, the number of ports of peripheral component interconnect express (PCIe) and double data rate (DDR) interfaces have nearly doubled in CPUs. Ball grid array (BGA) breakout in current CPUs is becoming a challenge due to the increased ...
更多查看译文
关键词
Couplings,Frequency-domain analysis,Conferences,Routing,Pins,High frequency,Electronics packaging
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要