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Structural and Nanomechanical Properties of Cu (inxga1–x)se2 Thin Films Fabricated by One-Step Sputtering

National Research Centre, Old Dominion University,Cao Wei

JOM(2021)SCI 3区SCI 4区

Thomas Jefferson National Accelerator Facility

Cited 10|Views8
Abstract
The structural and nanomechanical properties of Cu(InxGa1–x)Se2 films deposited on Si(100) substrate at different temperatures (25°C to 500°C) by one-step radiofrequency magnetron sputtering are discussed. X-ray diffraction analysis revealed a dominant (112) diffraction peak. The surface morphology was examined by field-emission scanning electron microscopy and atomic force microscopy. The film composition was examined by electron probe microanalysis. The Cu/(In + Ga) and Ga/(In + Ga) ratios were 0.9 and 0.3, respectively. Nanoindentation conducted in conjunction with scanning electron microscopy revealed that the films suffered severe delamination-type fracture due to poor adhesion to the Si substrate. The hardness of the films was not influenced by the substrate temperature except for the film grown at 500°C. The hardness was greatly affected at depths greater than the thickness of the film due to its poor adhesion. At deep indents, the hardness results agreed closely with that of the Si substrate.
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要点】:研究通过一步射频磁控溅射技术在不同温度下制备的Cu(InxGa1–x)Se2薄膜的结构和纳米力学性质,发现薄膜硬度受基板温度影响不大,但受其与基板粘附性影响显著。

方法】:采用X射线衍射分析、场发射扫描电镜、原子力显微镜以及电子探针微分析等手段研究薄膜的结构、表面形态和组成。

实验】:在Si(100)基板上,通过一步射频磁控溅射技术在不同温度(25°C至500°C)下制备Cu(InxGa1–x)Se2薄膜,并使用纳米压痕技术结合扫描电镜研究其纳米力学性质;结果表明,除在500°C下生长的薄膜外,薄膜硬度基本不受基板温度影响,但在深度大于薄膜厚度时,硬度结果与Si基板接近,显示出薄膜与基板间粘附性不佳。数据集名称未在文中明确提及。