Comparison Of The Barrier Properties Of Pvd And Ald Deposited Ta Based Materials For Cu Diffusion

Kaliappan Muthukumar, Atashi Basu, Ben-Li Sheu, Lu Chen,Zhiyuan Wu,Roey Shaviv, Joung Lee,Tae Hong Ha,Xianmin Tang

ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY（2018）

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