Integration Challenges for Terabit Class Mid Board Photonic Transceivers

Stephane Bernabe,Thomas Ferrotti, Badhise Ben Bakir, Bertrand Szelag,Fabien Gays,Andre Myko,Olivier Castany,Benoit Charbonnier,Marc Epitaux, Josh Cornelius, John Coronati,Frederic Boeuf,Charles Baudot,Christian Seassal

2016 IEEE CPMT SYMPOSIUM JAPAN (ICSJ)（2016）

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摘要

In this short paper we are describing three key challenges to be addressed in designing the next generation of Mid Board Optical Modules using Silicon Photonics technology: single mode fiber coupling, photonic circuit design in a dedicated environment (PDK), and laser integration using mass fabrication compatible techniques. These three challenges arc illustrated with some related achievements.

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关键词

Silicon photonics,laser integration,packaging,transceiver,on-board module

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