The unique properties of SiCN as bonding material for hybrid bonding

Serena Iacovo,Soon-Wook Kim,Fuya Nagano,Lan Peng,Fumihiro Inoue,Alain Phommahaxay,Eric Beync

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)（2021）

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摘要

Direct Cu-SiCN hybrid bonding is successfully realized by using a thermal budget of 250 degrees C. The excellent results should be attributed to the tight control on the different processing steps but also to the properties of the SiCN dielectric used as bonding material.

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关键词

bonding material,sicn,hybrid

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