Stress-strain study of QFN solder joints with different structural parameters under random vibration loading
2021 22nd International Conference on Electronic Packaging Technology (ICEPT)（2021）
Abstract
The simulation software ANSYS is used to analyze the stress and strain of the board-level circuit component model under random vibration load. As the selection SAC305 solder material to the solder pad QFN length, width and height as the experimental design variables, in order to stress the solder joints under random vibration load as a target value. The orthogonal experiment design method is used ...
MoreTranslated text
Key words
QFN solder joints,Vibration loading,Finite element analysis,Stress-strain,Orthogonal design,Variance,Range and variance analysis
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined