Development of planarizing spin-on carbon material for high-temperature processes
2021 China Semiconductor Technology International Conference (CSTIC)(2021)
摘要
For the last several advanced semiconductor nodes, as the industry moves towards 7- and 5-nm processes, the requirements for patterning and image transfer have increased dramatically. Multilayer material stacks are needed to pattern complex high-resolution structures. For carbon films, one key point is the tradeoff between planarization and high-temperature stability requirements used in patternin...
更多查看译文
关键词
Resistance,Solvents,Planarization,Films,Lithography,Surfaces,Inspection
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要