Characterization of Additively Formed Copper Layer by Blue Laser-Sintered Copper Nanoparticles
2021 International Conference on Electronics Packaging (ICEP)(2021)
摘要
We investigated the sintering of copper nanoparticles by blue diode laser in atmosphere to apply copper nanoparticles as preformed insert-materials for die bonding of power devices. Copper paste consisting of copper nanoparticles, ethylene glycol, and polyvinylpyrrolidone was formulated. The surface morphology and oxidation state of the sintered copper were evaluated. We found that the higher the ...
更多查看译文
关键词
Nanoparticles,Semiconductor lasers,Power lasers,Laser sintering,Atmosphere,Surface morphology,Morphology
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要