Enhanced Thermal Stability Of Ni/Gesn System Using Pre-Amorphization By Implantation

Improving the thermal stability of Ni/GeSn intermetallics is of great importance to avoid surface degradation and Sn segregation. For this purpose, we studied the effects of pre-amorphization by ion implantation (PAI) of GeSn layers prior to metallization. The impact of Si, Ge, C, or Ge + C PAI was evaluated in terms of phase sequence, morpohological, and electrical evolution during the solid-state reaction. The overall phase sequence, followed by in situ x-ray diffraction, was comparable with or without PAI and went as follows: the Ni5(GeSn)3 hexagonal phase was obtained first, followed by the mono-stanogermanide phase: Ni(GeSn). Nevertheless, the threshold temperature for phase formation varied. These variations, depending on the nature of the implanted ions, can be related to kinetic and/or thermodynamic factors as supported by the analysis of bibliography for silicides and germanides. Additionally, it was reported that the use of Si or Ge implantation did not significantly impacted the surface morphology of the layers. On the other hand, the implantation of C positively impacts the surface morphology evolution by delaying Sn long-range diffusion and Ni(GeSn) agglomeration. This trend was then highly beneficial for preserving electrical stability in an enhanced process window.