A Single-Layer Solution with Laser Debonding Technology for Temporary Bond/Debonding Applications in Wafer-Level Packaging
China Semiconductor Technology International Conference（2020）
关键词
advanced wafer-level packaging applications,wafer processes,laser-sensitive thermoplastics,laser debonding materials,wafer thinning,epoxy compound wafer,UV laser sources,thermosetting materials,cured material removal,single-layer solution,laser debonding technology,main driving forces,advanced packaging technologies,packaging houses,advanced packaging systems,process nodes,post-Moore's Law era,fan-out wafer-level packaging,temperature 300.0 degC
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