EBSD analysis of hot deformation behavior of Cu-Ni-Co-Si-Cr alloy

Cu-Ni-Si alloy is widely used in electronics industry due to its high electrical conductivity and high strength. In this paper, the Cu-Ni-Co-Si-Cr alloy is prepared by ZG-0.01 vacuum frequency induction melting furnace. The hot compression tests of the Cu-1.5Ni-1.1Co-0.65Si-0.2Cr alloy were carried out using the Gleeble-1500 simulator at 0.001–10 s−1 strain rates and 500–900 °C deformation temperatures. The microstructure changes of the alloy at 500–900 °C were studied. The changes in the hot deformation process for the Cu-1.5Ni-1.1Co-0.65Si-0.2Cr alloy were analyzed by EBSD. The dislocation density was sacrificed to promote recrystallization. The DRX grains texture of the alloy at 700 °C is {001} <100> cubic texture, which is replaced by the {011} <100> Goss texture at 900 °C. And the higher deformation temperature makes the texture more random by lowering the texture intensity. The precipitates of the Cu-1.5Ni-1.1Co-0.65Si-0.2Cr alloy are mainly disk-shaped and rod-shaped (Ni, Co)2Si. The constitutive equation of the Cu-1.5Ni-1.1Co-0.65Si-0.2Cr alloy was established to predict the behavior of the flow stress, and the activation energy is 634.45KJ/mol. Due to precipitation-hardened caused by (Ni, Co)2Si, the activation energy of the Cu-1.5Ni-1.1Co-0.65Si-0.2Cr alloy was much higher than the self-diffusion activation energy of pure copper. And the CDRX and DDRX mechanisms are two dominant DRX mechanisms for the Cu-1.5Ni-1.1Co-0.65Si-0.2Cr alloy.