Mechatronic Finger Structure with Pressure-Sensitive Conductive Layer

O. G. Dontu, A. Barbilian, C. Florea,I. Lascar,L. Dobrescu,I. Sebe, R. Scarlet, C. Mihaila,C. Moldovan, M. Pantazica,D. Besnea,B. Gramescu,D. Dobrescu, V. Lazo,B. Firtat,A. Edu

ROMANIAN JOURNAL OF INFORMATION SCIENCE AND TECHNOLOGY(2018)

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摘要
In this paper a unified approach of a mechatronic hand enriched with a pressure sensitive layer is analyzed. New developments of advanced applications regarding the Additive Manufacturing (AM) have been investigated and implemented. The analyze starts with a finger physical implementation, using 3-D printing technology. Digital Light Processing (DLP) is the 3-D printing selected process for finger structure manufacture. Fused Deposition Modeling (FDM) is another additive process used for outer protective layer and for its mold manufacture. A pressure-sensitive layer of Velostat is inserted between the outer protective layer and the finger structure. The paper presents a simple and efficient prototype of a finger, using a cheap and sufficient accurate solution based on new materials. The finger manufacturing process begins with the design of three-dimensional model for the mold without any supplementary equipment and classic technologies. Starting from a finger mechanical structure with its three phalanges, it is developed by adding a pressure sensitive layer of Velostat, towards a future desired artificial skin. Its electrical properties recommend it as a first layer that covers the printed finger structure. Another outer protective layer is also added. This finger structure will be integrated in a designed hand system.
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关键词
Mechatronic system,artificial finger,pressure-sensitive layer,3D printing,Digital Light Processing,Fused Deposition Modeling
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