Actively Aligned Flip-Chip Integration of InP to SiN Utilizing Optical Backscatter Reflectometry
european conference on optical communication(2019)
摘要
We present our hybrid III-V/SiN integration interface with a novel active alignment technique overcoming contacting limitations in flip-chip assembly. The interface allows for integration of single chips and full arrays. An average coupling loss of −2.1dB and a record coupled power exceeding 60mW is achieved.
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关键词
Hybrid integrated circuits,Flip-chip devices,Reflectometry,Silicon photonics,Semiconductor lasers
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