Current Load of Thick-film Pastes for Power Applications
2020 43rd International Spring Seminar on Electronics Technology (ISSE)（2020）
关键词
alumina substrate,electrical current load,performed measurements,measuring process,conductive path widths,mechanical solder joints,thick-film path,mechanically connected terminals,soldered terminals,path width,thick-film pastes,power applications,silver cermet thick-film conductors,size 0.05 mm,size 0.65 mm,temperature 350.0 degC,Al2O3
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