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Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development

Emilie Bourjot, Paul Stewart,C. Dubarry,E. Lagoutte,E. Rolland,Nicolas Bresson,G. Romano,D. Scevola,Viorel Balan,Jérôme Dechamp,Marc Zussy,Gaëlle Mauguen,Clément Castan,Loïc Sanchez,Amadine Jouve,Frank Fournel,Séverine Cheramy

2019 International 3D Systems Integration Conference (3DIC)（2019）

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关键词
3DIC,KGD,hybrid bonding,planarization,D2W
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