Novel Compact-Thermal-Model Approach to Estimate the Heat Spreading Effects of Flip-Chips on PCB Regarding Laminar Flow Regimes
2019 25TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC 2019)（2019）
关键词
microelectronic flip-chip assemblies,printed circuit boards,dynamic heat spreading,laminar convective fluid interactions,thermal equivalent resistor networks,power losses,fluid flow velocity,thermal conductivity,computational fluid dynamics software,complex fluid mechanical analysis,solid substrate,heat transfer,CTM,compact thermal models,material parameters,numerical simulations,thermal design,laminar flow,PCB
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