Novel Fine-Grain Back-Bias Assist Techniques for 3D-Monolithic 14 Nm FDSOI Top-Tier SRAMs

D. Bosch,X. Garros,A. Makosiej,L. Ciampolini,O. Weber,J. Lacord,J. Cluzel,B. Giraud,R. Berthelon,G. Cibrario,L. Brunet,P. Batude,C. Fenouillet-Beranger,D. Lattard,J. P. Colinge,F. Balestra,F. Andrieu

Solid-state electronics（2020）

引用 0|浏览100

暂无评分

关键词

3D monolithic,FDSOI,BTI stress,Supply Read Retention Voltage (SRRV),SRAM margins,SNM,WNM,Variability,Body biasing,SPICE,Technology-design optimization

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要