DETECT, UNDERSTAND AND FIX STARBURST DEFECT AT VIA LITHO FILM STACKS

Zhiguo Sun,Eswar Ramanathan,Mary Claire Silvestre,Tingge Xu,Kripa Chauhan,Vijaya Rana,Joseph Shepard,Vijayalakshmi Seshachalam, Minrui Wang,Anbu Selvam K. M. Mahalingam, Yang Bum Lee

2019 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC)（2019）

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Key words

metallic thin films,starburst nuisance defects,wafer scrap,hammer test method,repeated thermal cycle environment,physical failure analysis,hard mask,dielectric thin film,root cause,metallic layer,optimal film stack combinations,compressive stress,wafer patterning,litho film stacks,multicolor back end of line self-aligned via integration,SAV integration,lithography material analysis,stress metallic film,color lithography masks,dielectric thin films

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