High Heat Flux Removal Using Optimized Microchannel Heat Sink
2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)（2018）
Key words
advanced CMOS compatible silicon fabrication,high aspect ratio microchannels,thermal test chip,low thermal contact resistance,low total thermal resistance,high heat flux removal,optimized microchannel heat sink,silicon-based compact microchannel heat sink,high heat flux dissipation,silicon-based thermal test chip,heater die,pump power,cooling performance,3D modelling,size 160.0 mum,size 32.0 mum,wavelength 5.0 mm,wavelength 9.0 mm,size 5.0 mm,Cu-SnAu
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined