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Modified ALD TaN Barrier with Ru Liner and Dynamic Cu Reflow for 36nm Pitch Interconnect Integration

P. Bhosale,J. Maniscalco,Nicholas A. Lanzillo,Takeshi Nogami, Donald F. Canaperi,Koichi Motoyama,H. Huang,Paul S. McLaughlin,R. Shaviv,M. Stolfi, R. Vinnakota, G. How,S. Pethe, B. Sheu, X. Xie, L. Chen

2018 IEEE International Interconnect Technology Conference (IITC)（2018）

引用 8|浏览98
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关键词
PVD,ALD,TaN,Cu interconnect,Dynamic reflow,Ru liner,Co liner
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