Integration Of Micro-Contact Enhanced Thermoelectric Cooler With A Feeds Manifold-Microchannel System For Cooling Of High Flux Electronics
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)（2017）
Key words
Electronics cooling,Thermoelectric Cooling,Two-phase cooling,FEEDS,Microchannels,Hotspot cooling,TEC Optimization,Integration
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