Manufacturing and Characterization of Die to Die Interconnections for 3D Applications in Harsh Environmental Conditions
Electronic Packaging Technology Conference（2016）
关键词
3D technology,interconnection,stacking,automotive,copper pillars,solder balls
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要