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Femtosecond Laser Damage in Metals and Semiconductors During TriBeam Tomography

Microscopy and microanalysis(2016)

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摘要
The incorporation of ultrashort pulsed lasers into a dualbeam electron microscope, otherwise known as the TriBeam, has enabled applications such as the fast removal of material for tomography [1], micromachining, plasma based chemical diagnostics [2], and beam chemistry [3]. The unique low damage properties of commercial femtosecond lasers arise from the large impulse of energy imparted into the electronic structure of a material over time periods typically between 20-500 femtoseconds yielding complicated thermo-mechanical loading.
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