The influence of power spinning and annealing temperature on microstructures and properties of Cu-Sn alloy

Electron back scatter diffraction pattern (EBSD), metallographic microscope (OM) and transmission electron microscope (TEM) are used to analyze the microstructural state of the Cu-Sn alloy before and after power spinning and annealing. The results show that after power spinning, the α phase grains are refined and gradually evolve into small and fine αII and deformed αIII crystal grains, with an average grain size of about 2.2 μm. Work hardening results in massive network-like subgrain boundaries distributed in power spinning microstructure. Annealing at 400 °C contributes to the formation of dislocation cells and stacking faults, and high-angle grain boundaries (HABS) start to migrate and slide. After the formation of less defective equiaxed grains at 500 °C, twins continue to grow and widen based through continuous accumulation of stacking faults. Further testing of mechanical properties reveals that power spinning is conducive to the improvement of mechanical properties of Cu-Sn alloy.