Reliability engineering: Help enable technology scaling
china semiconductor technology international conference（2018）
Key words
reduced dppm,tolerable aging,accurate wafer level reliability characterization,far-BEOL,BEOL metal-via spacing requirements,low voltage stress data,CPI stress results,accurate dppms projections,extra reliability margins,dimension scaling,technology development,different grade levels,reliability engineering,technology scaling,characterization methods,circuit level,technology reliability,higher transistor voltage,product level reliability stack up,automotive applications
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