Study On The Temperature-Dependent Thermal Resistance Matrix Of A Multi-Chip Led-Matrix
2017 23RD INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC)（2017）
Key words
weight reduction,power density,heat sink temperatures,multi-chip LED-matrix systems,temperature dependency,thermal simulations,thermal properties,thermal transient measurements,thermal characterization,4-chip-matrix,thermal interdependencies,LED lighting system,thermal behavior,thermal management,size reduction,multiple LED-chips,high light output,solid lighting industry,temperature-dependent thermal resistance matrix
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