Development of liquid, granule and sheet type epoxy molding compounds for fan out wafer/panel level package
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)(2016)
摘要
Semiconductor market has still expanded and required more advanced and smaller package. To meet these requirements, FOWLP and/or Panel Level Package have marketed in recently. In this report, Liquid, Granule and Sheet materials were described as an encapsulation for FOWLP/Panel Level Package. Especially, warpage might be a key issue from the future standpoint for scaling up process and application. The discussion here touches the warpage issue for each material and process.
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关键词
sheet type epoxy molding compounds,sheet materials,FOWLP,semiconductor market,fan out wafer-panel level package,granule,liquid development
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