Influence of Minimum Barrier Metal Thickness at Trenches on Void Formation in 50-Nm-wide Cu WiringYasunori Chonan,Takashi Aoyam,Khyoupin Khoo,Jin OnukiElectrochemistry（2014）引用 0|浏览4暂无评分关键词Cu Interconnects,Trench,ULSI,Barrier LayerAI 理解论文溯源树样例生成溯源树，研究论文发展脉络Chat Paper正在生成论文摘要
