Solid-Liquid Interdiffusion (SLID) bonding
2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)（2016）
关键词
Solid-Liquid Interdiffusion Bonding,High-Temperature Applications,Transient Liquid Phase Bonding,Bond Strength
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要