Guidelines for Intermediate Back End of Line (BEOL) for 3D Sequential Integration.

C. Fenouillet-Beranger, S. Beaurepaire,F. Deprat, A. Ayeres de Sousa,L. Brunet,P. Batude,O. Rozeau,F. Andrieu,P. Besombes,M. -P. Samson,B. Previtali,F. Nemouchi,G. Rodriguez,P. Rodriguez,R. Famulok,N. Rambal,V. Balan,Z. Saghi,V. Jousseaume, C. Guerin, F. Ibars, F. Proud,D. Nouguier,D. Ney,V. Delaye,H. Dansas,X. Federspiel,M. Vinet

2017 47th European Solid-State Device Research Conference (ESSDERC)（2017）

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3D sequential integration,fluorine-free W barrier,W interconnections,3D VLSI,thermal stability,intermediate back end of line,iBEOL guidelines

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