Patterning of Opv Modules by Ultra-Fast Laser

A novel production process combining slot-die coating, transparent flexible IMI (ITO-Metal-ITO) electrodes and ultra-fast laser ablation can be used for the realization of P3HT:PCBM based thin film flexible OPV modules. The fast and precise laser ablation allows an overall efficiency over 3 % and a device geometric fill factor (GFF) over 95 %. Three functional layers can be ablated using the same wavelength only with varying the laser fluence and overlap. Different OPV device architectures with multilayers utilizing various materials are challenging for ablation but can be structured by using a systematical approach.