A compact 10×10 Gbps transmitter module based on a low cost 3D stacking solution
Santa Fe, NM(2013)
摘要
We demonstrate a wafer-scale process for making compact 3D stacked 10×10 Gbps transmitter chips. Error-free operation is obtained for 0 and 500 meter transmission in OM4-Plus fiber with a maximum 1.4 dB Rx sensitivity penalty.
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关键词
integrated optics,optical interconnections,optical transmitters,surface emitting lasers,om4-plus fiber,bit rate 10 gbit/s,distance 0 m,distance 500 m,sensitivity penalty,vertical cavity surface emitting lasers,cmos integrated circuits
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