A compact 10×10 Gbps transmitter module based on a low cost 3D stacking solution

O Raz,P Duan,S Dorrestein,K A Williams,D Molin,Pierre Sillard, F Kraemer,Barry Smalbrugge,Gerard Kuyt, S B Christensen, H Lysdal,J Duis,H J S Dorren

Santa Fe, NM（2013）

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摘要

We demonstrate a wafer-scale process for making compact 3D stacked 10×10 Gbps transmitter chips. Error-free operation is obtained for 0 and 500 meter transmission in OM4-Plus fiber with a maximum 1.4 dB Rx sensitivity penalty.

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关键词

integrated optics,optical interconnections,optical transmitters,surface emitting lasers,om4-plus fiber,bit rate 10 gbit/s,distance 0 m,distance 500 m,sensitivity penalty,vertical cavity surface emitting lasers,cmos integrated circuits

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