Effect of Joule Heating on Electromigration Reliability of Pb-free Interconnect
2012 IEEE 62nd Electronic Components and Technology Conference（2012）
Key words
electromigration,finite element analysis,flip-chip devices,integrated circuit interconnections,life testing,Joule self-heating,Pb-free interconnect,accelerated electromigration test,electromigration reliability,fully assembled flip chip module,localized Joule heating,microbumps,silicon to silicon assembly,stress current,thermal FEM model
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