Integration of thin film MIM capacitors and resistors into copper metallization based RF-CMOS and Bi-CMOS technologies

Peter Zurcher,P Alluri,Peir Chu,A Duvallet,C Happ,R G Henderson, J T Mendonca,Moon Suk Kim,M Petras,M V Raymond,Tarmo K Remmel,Doug Roberts,B Steimle, J J Stipanuk,Stephane Straub, T O Sparks,Marc Tarabbia,Helene Thibieroz,M K Miller

San Francisco, CA, USA（2000）

引用 90|浏览15

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bicmos integrated circuits,cmos integrated circuits,mim devices,copper,integrated circuit technology,metallisation,thin film capacitors,thin film resistors,bicmos technology,cu,rf cmos technology,capacitance density,copper metallization,metal thin film resistor,mixed-signal ic,sheet resistance,temperature coefficient of resistivity,thin film mim capacitor,thin film,negative temperature coefficient

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