Built-in Via Module Test Structure for Backend Interconnection In-Line Process Monitor

HY Li,WH Li,LY Wong,N Hwang

Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005 IPFA 2005

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摘要

The best in-line process monitoring test structure should have multiple purposes, one of which is to allow easy assessing and quick defect identification. In thus study, the via module test structure has been designed allowing easy assessment of the via profiles of via, coupled with the resistance measurement of the via, such can be used as effect via module defect monitor. This structure can be used as frame monitor structure. Via module test structure is realized in Cu / Low K (Black Diamond (TM)) interconnection.

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关键词

built-in self test,fault diagnosis,integrated circuit interconnections,process monitoring,Cu,built-in via module test structure,defect identification,frame monitor structure,in-line process monitoring test structure,low k interconnection,module defect monitoring,resistance measurement,via profiles

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