system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
J. U. Knickerbocker,P. S. Andry,L. P. Buchwalter,A. Deutsch,R. R. Horton,K. A. Jenkins,Y. H. Kwark,G. McVicker,C. S. Patel,R. J. Polastre,C. Schuster,A. Sharma,S. M. Sri-Jayantha,C. W. Surovic,C. K. Tsang,B. C. Webb,S. L. Wright,S. R. McKnight,E. J. Sprogis,B. Dang msra
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