A new technique for characterizing low-defect SIMOX
Materials Letters(1990)
摘要
Defect density in thin top silicon layer of SIMOX materials was investigated. TEM characterization of low-defect (< 106 cm−2) SIMOX was both cost and time prohibitive to inspect large areas. A new technique using a diluted Secco etch followed by a hydrofluoric acid decoration was developed to identify unambiguously such defects. The technique utilizes the same etchant and equipment used for defect characterization of single-crystalline silicon wafers and is found useful in SOI device development.
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关键词
low-defect
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